In the editorial published in March 2016, I mentioned that one of the aims of Micromachines is to cover topics and technologies beyond silicon-based microsystems and microdevices [1]. In fact, broadening application areas of micromachines beyond the traditional silicon-based sensors and actuators brings new challenges to the development of microfabrication technology. Conventional Micro Electro Mechanical Systems (MEMS) and Nano Electro Mechanical Systems (NEMS) are in the size range of micrometers and can be fabricated in batches using well-established photolithography and etching processes. Even with the integration of microelectronics, devices are often self-contained and easily packaged. Novel applications such as those in the areas of microfluidics and lab-on-a-chip (LOC) require device features in a size scale that differs with orders of magnitude. The mismatch in feature size and the multiscale nature of these devices bring new challenges to the device design, as well as the development of economic and large-scale fabrication processes. Imagine that one has to fabricate centimeter-large devices with precise features in the submicron scale. The large footprint and the precision required would make even batch fabrication on silicon substrate economically prohibitive. Thus, the challenge would be the integration of device components of different size scales, made of, different materials and by different fabrication techniques into the final product. The hybrid integration approach of traditional packaging provides a solution for this challenge. Recent papers published in Micromachines illustrate the diverse solutions for multiscale and multimaterial challenges posed.