Selective and Stable CO2 Electroreduction to CH4 via Electronic Metal–Support Interaction upon Decomposition/Redeposition of MOF
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Trinh, Quang Thang
Wang, Haojing
Wu, Shuyang
Arce-Ramos, Juan Manuel
Sullivan, Michael B
Kraft, Markus
Ager, Joel WW
Zhang, Jia
Xu, Rong
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Abstract
The CO2 electroreduction to fuels is a feasible approach to provide renewable energy sources. Therefore, it is necessary to conduct experimental and theoretical investigations on various catalyst design strategies, such as electronic metal–support interaction, to improve the catalytic selectivity. Here a solvent-free synthesis method is reported to prepare a copper (Cu)-based metal–organic framework (MOF) as the precursor. Upon electrochemical CO2 reduction in aqueous electrolyte, it undergoes in situ decomposition/redeposition processes to form abundant interfaces between Cu nanoparticles and amorphous carbon supports. This Cu/C catalyst favors the selective and stable production of CH4 with a Faradaic efficiency of ≈55% at −1.4 V versus reversible hydrogen electrode (RHE) for 12.5 h. The density functional theory calculation reveals the crucial role of interfacial sites between Cu and amorphous carbon support in stabilizing the key intermediates for CO2 reduction to CH4. The adsorption of COOH* and CHO* at the Cu/C interface is up to 0.86 eV stronger than that on Cu(111), thus promoting the formation of CH4. Therefore, it is envisioned that the strategy of regulating electronic metal–support interaction can improve the selectivity and stability of catalyst toward a specific product upon electrochemical CO2 reduction.
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Small
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19
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41
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Chemical and thermal processes in energy and combustion
Chemical engineering
Electrochemistry
Science & Technology
Physical Sciences
Technology
Chemistry, Multidisciplinary
Chemistry, Physical
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Liu, G; Trinh, QT; Wang, H; Wu, S; Arce-Ramos, JM; Sullivan, MB; Kraft, M; Ager, JWW; Zhang, J; Xu, R, Selective and Stable CO2 Electroreduction to CH4 via Electronic Metal–Support Interaction upon Decomposition/Redeposition of MOF, Small, 2023, 19 (41), pp. 2301379